Revealing the ductile-to-brittle transition mechanism in polycrystalline body-centered tetragonal tin (Sn) for cryogenic electronics
Xiaoliang Ji, Rong An, Wei Zhou, Ying Zhong, Fu Guo, Chunqing Wang
Topics & Concepts
Materials scienceBrittlenessCrystal twinningCrystalliteMetallurgyComposite materialDeformation mechanismMicrostructureElectronic Packaging and Soldering TechnologiesMicrostructure and mechanical propertiesAdvanced Welding Techniques Analysis