Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging
Lei Sun, Liang Zhang, Yi Zhang, Minghe Chen, Cong-Ping Chen
Topics & Concepts
Materials scienceIntermetallicSolderingComposite materialIndentation hardnessInterconnectionComposite numberDirect shear testVoid (composites)Shear (geology)Shear strength (soil)MetallurgyMicrostructureComputer networkSoil waterEnvironmental scienceSoil scienceComputer scienceAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis