Growth Behavior of Ni-Sn Intermetallic Compounds in Microbumps During Long-Term Aging Process
Peixin Chen, Chongyang Li, Chenlin Yang, Anmin Hu, Ming Li, Liming Gao, Huiqin Ling, Tao Hang, Yunwen Wu
Topics & Concepts
IntermetallicMaterials scienceNucleationDiffusionMicrostructureGrain sizeLayer (electronics)Phase (matter)Diffusion barrierMetallurgyComposite materialChemical engineeringThermodynamicsAlloyPhysicsOrganic chemistryChemistryEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrical Contact Performance and Analysis