Copper nanoparticles interlocked phase-change microcapsules for thermal buffering in packaging application
Sumit Parvate, Jitendra Singh, Jagadeeswara Reddy Vennapusa, Prakhar Dixit, Sujay Chattopadhyay
Topics & Concepts
Differential scanning calorimetryScanning electron microscopeMaterials scienceNanoparticleFourier transform infrared spectroscopyChemical engineeringTransmission electron microscopyCopperPhase-change materialThermal analysisNanotechnologyComposite materialThermalMetallurgyThermodynamicsPhysicsEngineeringMeteorologyPhase Change Materials ResearchPolymer composites and self-healing