A review of thermal performance of 3D stacked chips
Zhiqiang Wang, Rui Dong, Rihong Ye, Salvinder Singh Karam Singh, Shaofeng Wu, Chenxu Chen
Topics & Concepts
Materials scienceThermalNuclear engineeringMechanicsThermodynamicsPhysicsEngineeringThermal properties of materials3D IC and TSV technologiesHeat Transfer and Optimization