Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers
Xiao‐Fan Jiang, Zeming Tao, Yuan Li, Fangyuan Sun, Daquan Yu, Yi Zhong
Topics & Concepts
Materials scienceCoatingMechanism (biology)ThermalConductanceComposite materialChemical engineeringCondensed matter physicsThermodynamicsEpistemologyPhysicsPhilosophyEngineeringThermal properties of materialsElectronic Packaging and Soldering TechnologiesAdhesion, Friction, and Surface Interactions