Multiple kinds of peeling processes and instabilities in heterogeneous film peeling
Chuang-Shi Shen, Huanfang Wang, Fei Yao, Bo Li, Bo Zhou, Xi-Ning Zhao, Yong-Wang Zhang, Ze-Wei Li
Topics & Concepts
Materials scienceToughnessComposite materialInstabilityStiffnessHomogeneousAdhesiveBendingMechanicsPhysicsThermodynamicsLayer (electronics)Adhesion, Friction, and Surface InteractionsMechanical stress and fatigue analysisElectronic Packaging and Soldering Technologies