Modeling of thermal damage and residual stress in slicing of silicon wafers using wire-electrical discharge machining: Comparison with experiments
Pinal Rana, Divyanshu Bhartiya, Deepak Marla
Topics & Concepts
Materials scienceResidual stressWaferMachiningElectrical discharge machiningComposite materialHeat fluxFinite element methodSiliconStress (linguistics)ThermalHeat transferMetallurgyMechanicsStructural engineeringOptoelectronicsThermodynamicsPhysicsPhilosophyLinguisticsEngineeringAdvanced Machining and Optimization TechniquesAdvanced Surface Polishing TechniquesAdvanced machining processes and optimization