Corrosion-induced degradation and its mechanism study of Cu–Al interface for Cu-wire bonding under HAST conditions
Chien-Pan Liu, Shoou‐Jinn Chang, Yen-Fu Liu, James Su
Topics & Concepts
CorrosionMaterials scienceWire bondingIntermetallicMetallurgyAlloyCrevice corrosionComputer scienceChipTelecommunicationsIntegrated Circuits and Semiconductor Failure AnalysisElectronic Packaging and Soldering Technologies3D IC and TSV technologies