Influence of sputtering and electroless plating of Cr/Cu dual-layer structure on thermal conductivity of diamond/copper composites
Dong Zhao, Shuqing Zha, Dongguang Liu
Topics & Concepts
DiamondMaterials scienceThermal conductivityScanning electron microscopeComposite materialCopperSpark plasma sinteringLayer (electronics)MicrostructureSputteringMaterial properties of diamondConductivityMetallurgyThin filmNanotechnologyChemistryPhysical chemistryAluminum Alloys Composites PropertiesAdvanced materials and compositesDiamond and Carbon-based Materials Research