Enhancement of thermal conductivity and dimensional stability of polyimide/boron nitride films through mechanochemistry
Xianghui Ou, Shuangshuang Chen, Xuemin Lü, Qinghua Lu
Topics & Concepts
PolyimideMaterials scienceBoron nitrideThermal conductivityComposite materialExfoliation jointThermal expansionMechanochemistryThermal stabilityGrapheneChemical engineeringNanotechnologyLayer (electronics)EngineeringThermal properties of materialsTribology and Wear AnalysisAdvanced ceramic materials synthesis