Interfacial microstructure and mechanical properties of diffusion-bonded W–10Cu composite/AlN ceramic using Ni–P and Ti interlayers
Kuang-Hsiang Liao, Cherng-Yuh Su, Min-Yun Yu
Topics & Concepts
Materials scienceMicrostructureDiffusion bondingComposite materialThermal expansionCeramicComposite numberThermal shockUltimate tensile strengthDiffusionPhysicsThermodynamicsAdvanced materials and compositesMetal and Thin Film MechanicsIntermetallics and Advanced Alloy Properties