Kinetics of Cu6Sn5 and Cu3Sn intermetallic compounds growth and isothermal solidification during Cu-Sn transient liquid phase sintering process
Xianwen Peng, Yue Wang, Wanli Wang, Zheng Ye, Jian Yang, Jihua Huang
Topics & Concepts
Isothermal processIntermetallicMaterials scienceKineticsVolume fractionMetallurgySinteringPhase (matter)ThermodynamicsComposite materialChemistryAlloyOrganic chemistryPhysicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties