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Ferroelectric and Interlayer Co-optimization with In-depth Analysis for High Endurance FeFET

Yuejia Zhou, Zhongxin Liang, Wenpu Luo, Ming Yu, Runteng Zhu, Xiao Lv, Jiachen Li, Qianqian Huang, Fei Liu, Kechao Tang, Ru Huang

20222022 International Electron Devices Meeting (IEDM)41 citationsDOI

Abstract

In face of the critical endurance issue, for the first time we take a holistic perspective to co-optimize the ferroelectric materials and interlayer in FeFET. Compared to the common HZO based gate stack, the novel combination of Hf <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.95</inf> Al <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.05</inf> O <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> +Al <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> O <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> enhances the endurance to $\gt 5 \times 10 ^{9}$ cycles while maintaining a retention > 10 years. In-depth analysis based on DFT and DQSCV reveal the reduction of interlayer electric field and interface charge trapping as the mechanism of optimization. We also develop a distributed interface trap model to correlate different trapping dynamics with the interlayer property in each device. This work pushes forward the understanding and development of high endurance strategy for FeFET.

Topics & Concepts

FerroelectricityStack (abstract data type)Materials scienceTopology (electrical circuits)Computer scienceElectrical engineeringOptoelectronicsEngineeringDielectricOperating systemFerroelectric and Negative Capacitance DevicesSemiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit Design
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