Thermal analysis of electronic packaging structure using isogeometric boundary element method
Huiping Yu, Yubo Guo, Yanpeng Gong, Fei Qin
Topics & Concepts
Boundary element methodPiecewiseIsogeometric analysisComputer scienceWork (physics)Domain (mathematical analysis)Boundary (topology)Boundary value problemFinite element methodApplied mathematicsElectronic packagingMathematicsMathematical analysisTopology (electrical circuits)Mechanical engineeringElectronic engineeringStructural engineeringEngineeringCombinatoricsAdvanced Numerical Analysis TechniquesNumerical methods in engineeringIterative Methods for Nonlinear Equations