“Top-down” and “bottom-up” strategies for wafer-scaled miniaturized gas sensors design and fabrication
Lin Liu, Yingyi Wang, Fuqin Sun, Yanbing Dai, Shuqi Wang, Yuanyuan Bai, Lianhui Li, Tie Li, Ting Zhang, Sujie Qin
Abstract
Abstract Manufacture of large-scale patterned nanomaterials via top-down techniques, such as printing and slurry coating, have been used for fabrication of miniaturized gas sensors. However, the reproducibility and uniformity of the sensors in wafer-scale fabrication are still a challenge. In this work, a “top-down” and “bottom-up” combined strategy was proposed to manufacture wafer-scaled miniaturized gas sensors with high-throughput by in-situ growth of Ni(OH) 2 nanowalls at specific locations. First, the micro-hotplate based sensor chips were fabricated on a two-inch (2”) silicon wafer by micro-electro-mechanical-system (MEMS) fabrication techniques (“top-down” strategy). Then a template-guided controllable de-wetting method was used to assemble a porous thermoplastic elastomer (TPE) thin film with uniform micro-sized holes (relative standard deviation (RSD) of the size of micro-holes <3.5 %, n > 300), which serves as the patterned mask for in-situ growing Ni(OH) 2 nanowalls at the micro-hole areas (“bottom-up” strategy). The obtained gas microsensors based on this strategy showed great reproducibility of electric properties (RSD < 0.8%, n = 8) and sensing response toward real-time H 2 S detection (RSD < 3.5%, n = 8).