Enhanced Contact Performance and Thermal Tolerance of Ni/Bi<sub>2</sub>Te<sub>3</sub> Joints for Bi<sub>2</sub>Te<sub>3</sub>-Based Thermoelectric Devices
Jianqiang Zhang, Ping Wei, Huiqiang Zhang, Longzhou Li, Wanting Zhu, Xiaolei Nie, Wenyu Zhao, Qingjie Zhang
Abstract
Ni metal has been widely used as a barrier layer in Bi 2 Te 3 -based thermoelectric devices, which establishes stable joints to link Bi 2 Te 3 -based legs and electrodes. However, the Ni/Bi 2 Te 3 joints become very fragile when the devices were exposed to high temperature, causing severe performance deterioration and even device failure. Herein, stable Ni/Bi 2 Te 3 joints have been established by arc spraying of the Ni barrier layer on the Bi 2 Te 3 -based alloys. The interface microstructure and contact performance including the bonding strength and contact resistivity of the arc-sprayed Ni/Bi 2 Te 3 joints are investigated. The results indicate that, as compared with traditional Ni/Bi 2 Te 3 joints, the arc-sprayed Ni/Bi 2 Te 3 joints have comparably low contact resistivity while possessing a 50% higher bonding strength. Aging the joints as an exposure to high-temperature circumstances, the arc-sprayed Ni/Bi 2 Te 3 joints exhibit much better tolerance to the thermal shock with stable bonding strength and contact resistivity. The enhanced interfacial contact performance and thermal tolerance should be attributed to the thick Ni barrier layer and interface reaction layer with good Ohmic contact. This work provides an effective strategy to establish stable joints for the Bi 2 Te 3 -based thermoelectric devices with improved thermal stability.