Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
Wei Sun, Lizhe Wang, Nan Zhu, Jiyuan Xin, Yunchao Luo, Xingrui Jiang, Guohua Fan, Min Chen
Topics & Concepts
Materials scienceComposite materialResidual stressEpoxyFinite element methodStructural engineeringEngineeringSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies