Plasma-activated GaAs/Si wafer bonding with high mechanical strength and electrical conductivity
Yongqiang Zhao, Wen Liu, Yidi Bao, Fuhua Yang, Xiaodong Wang
Topics & Concepts
Materials scienceWaferWafer bondingOhmic contactOptoelectronicsHeterojunctionSurface roughnessSiliconAnodic bondingAmorphous solidDopingComposite materialLayer (electronics)CrystallographyChemistry3D IC and TSV technologiesElectrostatic Discharge in ElectronicsIntegrated Circuits and Semiconductor Failure Analysis