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Evolution of interfacial IMCs and mechanical properties of Sn–Ag–Cu solder joints with Cu-modified carbon nanotube

Bin Chen, Haozhong Wang, Minming Zou, Xiaowu Hu, Wenjing Chen, Xiongxin Jiang

2022Journal of Materials Science Materials in Electronics18 citationsDOI

Topics & Concepts

Materials scienceSolderingComposite materialComposite numberNanoindentationCarbon nanotubeIntermetallicShear strength (soil)Differential scanning calorimetrySolder pasteMetallurgyAlloyThermodynamicsSoil waterSoil sciencePhysicsEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies
Evolution of interfacial IMCs and mechanical properties of Sn–Ag–Cu solder joints with Cu-modified carbon nanotube | Litcius