The effect of amino acid addition in CeO2-based slurry on SiO2/Si3N4 CMP: Removal rate selectivity, morphology, and mechanism research
Xinyu Han, Shihao Zhang, Renhao Liu, Fangyuan Wang, Baimei Tan, Xinyu Zhao, Jiadong Zhao, Yunhui Shi
Topics & Concepts
SelectivitySlurryMorphology (biology)Mechanism (biology)Chemical engineeringChemistryMaterials scienceOrganic chemistryComposite materialCatalysisGeologyEngineeringPhilosophyEpistemologyPaleontologyAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesisMetal Extraction and Bioleaching