Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies
Wenchao Tian, Yifan Wang, Haojie Dang, Huahua Hou, Yuanyuan Xi
Abstract
Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical scenarios such as high-speed data center interconnects and integrated optical communication systems. Facing the persistent demand for information processing capabilities in the post-Moore era, photonic chips have emerged as a pivotal direction for overcoming the performance bottlenecks of traditional chips, leveraging their advantages of low power consumption, high speed, and high integration density. This review focuses specifically on the optical interconnection and packaging technologies for photonic chips. It comprehensively analyzes the research frontiers and key challenges in packaging technologies, encompassing efficient fiber-to-chip coupling techniques, chip-scale optical interconnection technologies, and 2D, 2.5D, and 3D stacked co-packaged optics technologies. By synthesizing and summarizing recent research advances, this paper aims to provide researchers in related fields with a systematic understanding of photonic integrated circuit technology. Furthermore, it seeks to offer insights for future technological breakthroughs in device optimization, packaging innovation, and system-level applications of photonic integrated circuits.