Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate
Shuai Wang, Jiayun Feng, Shang Wang, Kaifeng Wang, Muying Yu, Yanhong Tian
Topics & Concepts
Materials scienceIntermetallicSolderingAlloyMelting pointIsothermal processElectronic packagingWettingHigh entropy alloysDimpleSolderabilityMetallurgyComposite materialThermodynamicsPhysicsHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsIntermetallics and Advanced Alloy Properties