Investigation of expandable fillers for reversible adhesive bonding in photovoltaic modules
Florian Wanghofer, Archim Wolfberger, Gernot Oreški, Lukas Neumaier, Sandra Schlögl
Topics & Concepts
AdhesiveMaterials scienceComposite materialSiliconeCuring (chemistry)Layer (electronics)Surface Modification and SuperhydrophobicityElectronic Packaging and Soldering TechnologiesAdvanced Sensor and Energy Harvesting Materials