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Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves

Ying Lin, Yunxiao Zhang, Yuhao Liu, Kangning Wu, Helong Li, Jianing Wang, Kejie Li, Lijian Ding

2022IEEE Journal of Emerging and Selected Topics in Power Electronics25 citationsDOI

Abstract

Electric field stress concentration is one of the causes of partial discharge (PD) in power modules, which threatens the power modules’ safe operation. Herein, this article investigates the influences of temperature (from 150 to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$250~^{\circ }\text{C}$ </tex-math></inline-formula> ) and operation duration on the maximum electric field stress at the triple point (silicone elastomers, ceramic, and copper). It reveals that the maximum electric field stress rises with the increase in temperature, while the maximum electric field first increases but then decreases along the operation duration, especially under low temperature. Both the influences of temperature and the operation duration are related to the permittivity (dominated by the relaxation of Si–O bonds), low-frequency dispersion (LFD) phenomenon, and dc conductivities of silicone elastomers, which can be manipulated to suppress electric field stress concentration. This article provides a method to accurately calculate the electric field. The results are also critical to evaluation and improvement of power modules’ insulation.

Topics & Concepts

Electric fieldMaterials scienceStress (linguistics)PermittivitySiliconeDielectricRelaxation (psychology)Field (mathematics)Electrical engineeringComposite materialCondensed matter physicsPhysicsOptoelectronicsMathematicsEngineeringQuantum mechanicsPsychologyPure mathematicsPhilosophySocial psychologyLinguisticsHigh voltage insulation and dielectric phenomenaDielectric materials and actuatorsAdvanced Sensor and Energy Harvesting Materials
Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves | Litcius