Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type
Iva Králová, Dominik Pilnaj, Ognen Pop‐Georgievski, Jonáš Uřičář, Petr Veselý, Markéta Klimtová, Karel Dušek
Topics & Concepts
WettingFlux (metallurgy)Lead (geology)SolderingMaterials sciencePlasmaType (biology)MetallurgyComposite materialNanotechnologyPhysicsNuclear physicsGeologyPaleontologyGeomorphologyElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies