Thermal contact analysis of cracked through-silicon via structures in integrated circuits
Tom Wu, Tao Xue, Xiaobing Zhang
Topics & Concepts
Materials scienceSiliconIntegrated circuitThermalElectronic circuitThermal contactThermal analysisEngineering physicsOptoelectronicsMechanical engineeringComputer scienceElectrical engineeringThermodynamicsPhysicsEngineeringElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques3D IC and TSV technologies