Si-mediated reassembly of interfacially segregated Sc atoms in an Al–Cu–Sc alloy exposed to high-temperature creep
Yihan Gao, Lingfei Cao, J. Kuang, Hui Song, Jinyu Zhang, Gang Liu, Jun Sun
Topics & Concepts
Materials sciencePrecipitationAlloyDispersion (optics)Phase (matter)CreepAluminiumDecompositionImpurityChemical engineeringMetallurgyChemistryOpticsPhysicsOrganic chemistryEngineeringMeteorologyAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesMicrostructure and mechanical properties