Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects
Yaohui Fan, Yifan Wu, Travis Dale, Sukshitha Achar Puttur Lakshminarayana, Colin V. Greene, Nilesh Badwe, Raiyo Aspandiar, John E. Blendell, Ganesh Subbarayan, Carol A. Handwerker
Topics & Concepts
IntermetallicMaterials scienceSolderingEutectic systemMetallurgyMicrostructureSurface finishAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis