Towards Reliable Adhesive Bonding: A Comprehensive Review of Mechanisms, Defects, and Design Considerations
Dacho Dachev, Mihalis Kazilas, Giulio Alfano, Sadik Omairey
Abstract
Adhesive bonding has emerged as a transformative joining method across multiple industries, offering lightweight, durable, and versatile alternatives to traditional fastening techniques. This review provides a comprehensive exploration of adhesive bonding, from fundamental adhesion mechanisms, mechanical and molecular, to application-specific criteria and the characteristics of common adhesive types. Emphasis is placed on challenges affecting bond quality and longevity, including defects such as kissing bonds, porosity, voids, poor cure, and substrate failures. Critical aspects of surface preparation, bond line thickness, and adhesive ageing under environmental stressors are analysed. Furthermore, this paper highlights the pressing need for sustainable solutions, including the disassembly and recyclability of bonded joints, particularly within the automotive and aerospace sectors. A key insight from this review is the lack of a unified framework to assess defect interaction, stochastic variability, and failure prediction, which is mainly due complexity of multi-defect interactions, the compositional expense of digital simulations, or the difficulty in obtaining sufficient statistical data needed for the stochastic models. This study underscores the necessity for multi-method detection approaches, advanced modelling techniques (i.e., debond-on-demand and bio-based formulations), and future research into defect correlation and sustainable adhesive technologies to improve reliability and support a circular materials economy.