Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity
Hwangsun Kim, Jee Hyuk Ahn, Seung Zeon Han, Janghyun Jo, Hionsuck Baik, Miyoung Kim, Heung Nam Han
Topics & Concepts
AlloyMaterials scienceElectrical resistivity and conductivityTransmission electron microscopyDislocationScanning electron microscopePrecipitation hardeningPrecipitationMetallurgyConductivityHardening (computing)Strain hardening exponentComposite materialNanotechnologyChemistryElectrical engineeringPhysical chemistryMeteorologyPhysicsLayer (electronics)EngineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties