Pressureless joining of SiC by molten Si infiltration to the SiC/C filler tape and residual stress analysis
Pipit Fitriani, Ferry Iskandar, Pinar Colkesen, Dang‐Hyok Yoon
Topics & Concepts
Materials scienceComposite materialResidual stressFiller (materials)Raman spectroscopyJoint (building)Silicon carbideCeramicPhysicsArchitectural engineeringOpticsEngineeringAdvanced ceramic materials synthesisAdvanced materials and compositesAluminum Alloys Composites Properties