Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
Kongping Wu, Leng Zhang, Fangzhen Li, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu
Topics & Concepts
Vacancy defectMaterials scienceDiamondCarbon fibersInterface (matter)ConductanceThermalThermal conductivityComposite materialCondensed matter physicsCrystallographyThermodynamicsChemistryComposite numberPhysicsCapillary numberCapillary actionDiamond and Carbon-based Materials ResearchThermal properties of materialsAdhesion, Friction, and Surface Interactions