Designing high thermal conductivity of polydimethylsiloxane filled with hybrid h-BN/MoS2 via molecular dynamics simulation
Yafei Wang, Zhicheng Chang, Ke Gao, Ziwei Li, Guanyi Hou, Jun Liu, Liqun Zhang
Topics & Concepts
Thermal conductivityMaterials scienceComposite materialPolydimethylsiloxaneBoron nitrideComposite numberMolybdenum disulfideThermalNanocompositeFiller (materials)Molecular dynamicsThermodynamicsChemistryComputational chemistryPhysicsThermal properties of materialsGraphene research and applications2D Materials and Applications