Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via
Kezhong Xu, Yuqi Zhou, Yu Ziniu, Yuhan Gao, Yuxin Chen, Xin Lei, Chuanguo Xiong, Weishan Lv, Fulong Zhu
Topics & Concepts
TantalumThinningHeterojunctionCopperWaferSiliconMaterials scienceOptoelectronicsNanotechnologyMetallurgyBiologyEcologyAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure Analysis3D IC and TSV technologies