Effect of EDTA and CH2O on copper recovery from simulated electroless copper plating spent rinse water by unseeded fluidized-bed granulation process
Mark Daniel G. de Luna, Jenelyn A. Capito, Anabella C. Vilando, Ming‐Chun Lu
Topics & Concepts
CopperGranulationMetallurgyEthylenediaminetetraacetic acidCopper platingFluidized bedChemistryMaterials scienceNuclear chemistryChelationElectroplatingComposite materialLayer (electronics)Organic chemistryExtraction and Separation ProcessesRecycling and Waste Management TechniquesMembrane-based Ion Separation Techniques