Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
Yunxiang Huang, Gen Li, Tianyu Bai, Yieljae Shin, Xiaoxin Wang, Asst. Prof. Ashwini More, Pierre Boucher, Chandramouli Chandrasekaran, Jifeng Liu, Hui Fang
Abstract
The integration of flexible electronics and photonics has the potential to create revolutionary technologies, yet it has been challenging to marry electronic and photonic components on a single polymer device, especially through high-volume manufacturing. Here, we present a robust, chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where several post-fabricated, ultrathin, polymer electronic, and optoelectronic chiplets are vertically bonded into one single chip at room temperature and then shaped into application-specific form factors with monolithic Input/Output (I/O). As a demonstration, we applied this process and developed a flexible 3D-integrated optrode with high-density arrays of microelectrodes for electrical recording and micro light-emitting diodes (μLEDs) for optogenetic stimulation while with unprecedented integration of additional temperature sensors for bio-safe operations and shielding designs for optoelectronic artifact prevention. Besides achieving simple, high-yield, and scalable 3D integration of much-needed functionalities, CHIP also enables double-sided area utilization and miniaturization of connection I/O. Systematic device characterization demonstrated the successfulness of this scheme and also revealed frequency-dependent origins of optoelectronic artifacts in flexible 3D-integrated optrodes. In addition to enabling excellent manufacturability and scalability, we envision CHIP to be generally applicable to numerous polymer-based devices to achieve wide-ranging applications.