Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints
Chuan-Jiang Wu, Liang Zhang, Lei Sun, Peipei Huang, Xingyu Guo
Topics & Concepts
Materials scienceSolderingCompression (physics)Mechanism (biology)MetallurgyComposite materialEpistemologyPhilosophyElectronic Packaging and Soldering TechnologiesAdvanced materials and compositesInjection Molding Process and Properties