Influence mechanism of Au layer thickness on wettability of Sn–Ag–Cu solder on heated ENIG pads
Jie Wang, Qian Sun, Xiao Tang, Xiao Nan Wang, Akira Kato
Topics & Concepts
WettingSolderingMaterials scienceIntermetallicLayer (electronics)Substrate (aquarium)MetallurgyMorphology (biology)Wetting layerComposite materialSurface finishAlloyGeologyPaleontologyOceanographyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability