High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel
Renke Kang, Yu Zhang, Shang Gao, Jinxing Huang, Xianglong Zhu
Topics & Concepts
Materials scienceWaferGrindPolishingGrindingGrinding wheelSurface roughnessComposite materialMachiningDiamondSiliconFabricationSubstrate (aquarium)Surface integritySurface finishLayer (electronics)MetallurgyOptoelectronicsOceanographyAlternative medicinePathologyMedicineGeologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques