Thermal-electrical coupling effect on the reliability of copper pillar bump joints with different initial IMC thickness and microstructure
Jiayun Feng, Shuai Wang, Wei Wang, Jianchao Liang, Jiayue Wen, Shang Wang, Ruyu Tian, Yanhong Tian
Topics & Concepts
Materials scienceMicrostructureCopperPillarComposite materialCoupling (piping)Reliability (semiconductor)ThermalMetallurgyStructural engineeringThermodynamicsPower (physics)EngineeringPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability