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Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics

Win‐Jet Luo, Pramod Vishwakarma, Chen-Chien Hsieh, Bivas Panigrahi

2022Applied Thermal Engineering27 citationsDOI

Topics & Concepts

Heat sinkMicrofluidicsPolydimethylsiloxaneMaterials scienceElectronicsThermal conductivityNanotechnologyNanocompositeThermal management of electronic devices and systemsThermal resistanceThermalComposite materialMechanical engineeringElectrical engineeringEngineeringPhysicsMeteorologyThermal properties of materialsHeat Transfer and OptimizationAdvanced Sensor and Energy Harvesting Materials
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