Microstructure, properties, and formation mechanisms of tungsten/steel hot isostatic pressing diffusion bonding joint utilizing a Ni-Si-B interlayer
Yue Wang, Shuai Chen, Jian Yang, Jihua Huang, Shuhai Chen, Zheng Ye
Topics & Concepts
Materials scienceDiffusion bondingTungstenMicrostructureLayer (electronics)Composite materialBrittlenessDiffusionHot isostatic pressingDiffusion layerMetallurgyDiffusion barrierShear strength (soil)Joint (building)Atomic diffusionSolid solutionCrystallographyEngineeringEnvironmental scienceSoil scienceSoil waterPhysicsChemistryArchitectural engineeringThermodynamicsAdvanced materials and compositesAluminum Alloys Composites PropertiesElectronic Packaging and Soldering Technologies