Advanced Flip Chip Packaging
Gan Chong Leong, Chen-Yu, Huang
Topics & Concepts
Flip chipThermal copper pillar bumpInterconnectionBall grid arrayPackage on packageChipChip-scale packageInterposerSolderingElectronic engineeringReliability (semiconductor)Materials scienceEmbedded systemComputer scienceEngineeringElectrical engineeringOptoelectronicsNanotechnologyTelecommunicationsComposite materialPower (physics)PhysicsWaferEtching (microfabrication)Layer (electronics)Quantum mechanicsWafer dicingAdhesiveElectronic Packaging and Soldering Technologies3D IC and TSV technologiesVLSI and Analog Circuit Testing