Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach
Jianhao Wang, Xunda Liu, Fupeng Huo, Kento Kariya, Noriyuki Masago, Hiroshi Nishikawa
Topics & Concepts
Materials scienceIntermetallicMicrostructureBrittlenessComposite materialShear strength (soil)Liquid phaseDie (integrated circuit)Bonding strengthPhase (matter)Melting pointJoint (building)Shear (geology)MetallurgyStructural engineeringSoil waterAlloyEnvironmental scienceSoil scienceOrganic chemistryChemistryNanotechnologyPhysicsThermodynamicsEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise Suppression