The Sintering Process and Vibration Characteristics for Leadless Package Structure of Pressure Sensors
Guijiu Xie, Zhong Jin, Junwang Tian, Xin Tang, Junhui Li
Abstract
A key factor restricting the development of high-temperature pressure sensors is the packaging structure. The traditional lead package with silicone oil as the medium is difficult to meet the performance requirements in high-temperature environments. In this article, the anodic bonding method is used to bond the SOI pressure-sensitive chip and the borosilicate glass to form a vacuum chamber, which avoids the use of silicone oil. The glass hole is filled with high-temperature nanosilver paste, and the glass paste is printed on the surface. After being butted with the pins of the Kovar base, the sensor is sintered under a vacuum to realize the package of the sensor. Taking the shear strength of joint and porosity of silver paste as evaluation indexes, the optimal process parameters of silver paste and glass paste integrated sintering are studied by the Taguchi orthogonal experiment. Finite element simulation was used to analyze the vibration characteristics of the sensor, and its short-term vibration reliability was verified through vibration tests. The static output of the sensor shows that this packaging process can make it maintain good nonlinearity at high and low temperatures.