Flexible and Robust Ti<sub>3</sub>C<sub>2</sub>T<sub><i>x</i></sub>/(ANF@FeNi) Composite Films with Outstanding Electromagnetic Interference Shielding and Electrothermal Conversion Performances
Bo Zhao, Zhonglei Ma, Yuyao Sun, Yixuan Han, Junwei Gu
Abstract
Flexible and robust multifunctional electromagnetic interference (EMI) shielding materials are playing an increasingly important role in areas of aerospace, electronic communication, artificial intelligence, and wearable electronic devices. Herein, the magnetic and conductive Ti 3 C 2 T x /(ANF@FeNi) EMI shielding composite films are fabricated via in situ growth and vacuum‐assisted filtration methods. The introduction of magnetic FeNi nanoparticles can effectively enhance the electromagnetic recombination losses, leading to improved EMI shielding effectiveness (EMI SE) of the composite films. The obtained Ti 3 C 2 T x /(ANF@FeNi) composite films show excellent EMI shielding and electrothermal conversion performances. When the mass fraction of Ti 3 C 2 T x and FeNi fillers is 60 wt% and their mass ratio is 4:1, the EMI SE of the composite films (50 μm) reaches 60.7 dB in the X‐band (8.2–12.4 GHz). When a low voltage of 3 V is applied, the surface heating temperature of the composite films quickly reaches 111.2 °C. Moreover, the composite films possess satisfied long‐term heating stability under the constant applied voltage. In addition, the composite films exhibit excellent thermal conductivity and mechanical properties. The thermal conductivity ( λ ) and thermal diffusivity ( α ) reach 4.72 W m −1 K −1 and 4.36 mm 2 s −1 , respectively, and the tensile strength and tensile modulus reach 113.4 MPa and 3.1 GPa, respectively.