Parametric study on conductive patterns by low-temperature sintering of micron silver ink
Man Zhao, Gongwen Tang, Shuai Yang, Shancan Fu
Abstract
Ω cm at 140 °C for 30 min under a pressure of 10 MPa. Moreover, the electrical resistivity of the sintered silver pattern for RS for 20 min does not change significantly after 6000 bending cycles. This work provides a new method to fabricate conductive patterns using micron silver flakes with the purpose of promoting the application of silver inks.
Topics & Concepts
InkwellSinteringMaterials scienceElectrical conductorParametric statisticsConductive inkComposite materialLayer (electronics)Sheet resistanceMathematicsStatisticsNanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsAdditive Manufacturing and 3D Printing Technologies