Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging
Jingyu Qiao, Xingchao Mao, Lulin Xie, Shichen Xie, K. N. Tu, Yingxia Liu
Topics & Concepts
Materials scienceSolderingElectronic packagingMelting pointMetallurgyComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies