Understanding the impact response of lead-free solder at high strain rates
Xu Long, Junmeng Xu, Shaobin Wang, Wenbin Tang, Chao Chang
Topics & Concepts
Materials scienceSolderingSplit-Hopkinson pressure barStrain rateComposite materialDrop impactFlow stressMicrostructureSofteningStrain (injury)Stress (linguistics)MetallurgyScanning electron microscopeConstitutive equationDrop (telecommunication)Finite element methodStructural engineeringLinguisticsWettingPhilosophyEngineeringMedicineTelecommunicationsInternal medicineComputer scienceHigh-Velocity Impact and Material BehaviorElectromagnetic Launch and Propulsion TechnologyEnergetic Materials and Combustion